Document Type
Patent
Publication Date
August 2004
Patent Number
6780755
Abstract
A method of forming a multilevel conductor structure for ULSI circuits is provided. The structure includes a substrate having a plurality of dielectric supports extending from the substrate to support conductor layers. A removable material is deposited progressively on the substrate. An insulating ‘dome’ is formed over the conductor envelope and the material. Openings are provided through the dome for removing the material. The evacuated ‘dome envelope’ is filled with a near-unity dielectric constant gas or liquid at or above atmospheric pressure to enhance heat removal. The openings are sealed to provide a dielectric medium around the conductors within the envelope. Metal conductors within the envelope electrically connect active devices to other active regions as well as to the external environment. Additionally, ‘thermal columns’ extending through the envelope aid in heat removal, and inorganic ‘support blocks’ extending from the substrate to the dome provide mechanical integrity for external wire bonding.
Application Number
10/266,179
Recommended Citation
Wade, Thomas E., "Gas dome dielectric system for ULSI interconnects" (2004). USF Patents. 760.
https://digitalcommons.usf.edu/usf_patents/760
Assignees
University of South Florida
Filing Date
10/07/2002
Primary/U.S. Class
438/622
