Vertical microcoaxial interconnects

Authors

Justin Boone
Subramanian Krishnan
Shekhar Bhansali

Document Type

Patent

Publication Date

November 2015

Patent Number

9178261

CPC

H01P 5/085(20130101),

Abstract

In one embodiment, a vertical microcoaxial interconnect includes a dielectric substrate having a top side and a bottom side, an inner conductor extending through the substrate from its top side to its bottom side, an outer conductor that extends through the substrate from its top side to its bottom side, the outer conductor surrounding the inner conductor, a signal line extending to the inner conductor without contacting the outer conductor, and a ground line extending to the outer conductor without contacting the inner conductor or the signal line.

Application Number

14/047,191

Recommended Citation

Boone, Justin; Krishnan, Subramanian; and Bhansali, Shekhar, "Vertical microcoaxial interconnects" (2015). USF Patents. 67.
https://digitalcommons.usf.edu/usf_patents/67

Assignees

University of South Florida

Filing Date

10/07/2013