Document Type

Patent

Publication Date

August 2006

Patent Number

7091918

Abstract

In accordance with the present invention, an aperture rectenna is provided where the substrate is transparent and of sufficient mechanical strength to support the fabricated structure above it. An aperture antenna is deposited on the transparent substrate and a metal-insulator-metal (MIM) diode is constructed on top of the aperture antenna. There is an insulating layer between the aperture antenna metal and the metal ground plane optimized to maximize the collection of incident radiation. The top of the structure is capped with a metal ground plane layer, which also serves as the DC connection points for each rectenna element.

Application Number

10/904,121

Assignees

University of South Florida

Filing Date

10/25/2004

Primary/U.S. Class

343/767

Share

COinS