Document Type

Patent

Publication Date

September 2015

Patent Number

9123690

CPC

H01L 29/408(20130101), G03F 1/42(20130101), H01L 21/283(20130101)

Abstract

In one embodiment, an electrical circuit formed on a substrate includes a first multi-layer stack and a second multi-layer stack that share a top layer that comprises a continuous piece of conductive material.

Application Number

14/057,695

Assignees

University of South Florida

Filing Date

10/18/2013

Share

COinS