Document Type
Patent
Publication Date
June 2011
Patent Number
7958906
Abstract
In accordance with an embodiment of the present invention, a thermally induced single-use valve is provided including a silicon wafer having a top surface and a bottom surface and at least one cavity formed in the bottom surface of the wafer, a thermally deformable membrane suspended across the cavity on the top surface of the wafer and at least one resistive element patterned on top of the thermally deformable membrane.
Application Number
11/734,090
Recommended Citation
Cardenas-Valencia, Andres M.; Dlutowski, Jay; Cardenas, Michelle; Bumgarner, John; Wang, Weidong; and Langebrake, Larry, "Thermally induced single-use valves and method of use" (2011). USF Patents. 406.
https://digitalcommons.usf.edu/usf_patents/406
Assignees
University of South Florida
Filing Date
04/11/2007
Primary/U.S. Class
137/72
