Document Type
Article
Publication Date
August 2023
Patent Number
11732171
CPC
F28D 20/023, F28F 21/06, F28F 21/089, C09K 5/063, C09K 5/10, C09K 5/00, C23C 18/1641, C23C 18/165, C23C 18/1653, C23C 18/1824, C23C 18/1831, C23C 24/00, C23C 24/06
Abstract
In one embodiment, a metal-plated polymer object includes a polymer surface, a first metal layer that has been applied to the polymer surface to render it electrically conductive, and a second metal layer that has been deposited on the first metal layer.
Application Number
16/709408
Recommended Citation
Dhau, Jaspreet; Goswami, D. Yogi; Jotshi, Chand K.; and Stefanakos, Elias K., "Encapsulation of thermal energy storage media" (2023). USF Patents. 1346.
https://digitalcommons.usf.edu/usf_patents/1346
Assignees
UNIVERSITY OF SOUTH FLORIDA
Filing Date
12/10/2019