Self-Assembly for Integration of Microscale Thermoelectric Coolers
Document Type
Article
Publication Date
2009
Keywords
thermoelectric cooler, self-assembly, Monte Carlo simulation, bismuth telluride
Digital Object Identifier (DOI)
https://doi.org/10.1007/s11664-008-0627-9
Abstract
Optimum thermoelectric cooling (TEC) solutions often require the integration of component sizes inaccessible by common manufacturing techniques such as thin-film processing and robotic assembly. This work considers an application case in which small elements (100 μm to 300 μm thick) are optimal. A capillary self-assembly process is presented as a potential route to manufacturing TECs in these size ranges. A millimeter-scale demonstration of the assembly concept is presented and Monte Carlo simulation is used to study the scaling of the self-assembly approach to assemblies with more components. While assembly rate and system yield can be a challenge, several approaches are presented for increasing both rate and yield.
Was this content written or created while at USF?
Yes
Citation / Publisher Attribution
Journal of Electronic Materials, v. 38, issue 7, p. 1252-1256
Scholar Commons Citation
Crane, Nathan B.; Mishra, Pradeep; Murray, Jeffrey L.; and Nolas, G S., "Self-Assembly for Integration of Microscale Thermoelectric Coolers" (2009). Mechanical Engineering Faculty Publications. 30.
https://digitalcommons.usf.edu/egr_facpub/30
