"Moisture Effects on Copper Thin Film Adhesion" by Patrick J. Waters and Alex A. Volinsky
 

Moisture Effects on Copper Thin Film Adhesion

Document Type

Conference Proceeding

Publication Date

2005

Digital Object Identifier (DOI)

https://doi.org/10.1115/IMECE2005-81532

Was this content written or created while at USF?

Yes

Citation / Publisher Attribution

Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition, Orlando, Florida, USA. November 5-11, 2005

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