Moisture Effects on Copper Thin Film Adhesion

Authors

Patrick J. Waters, University of South Florida
Alex A. Volinsky, University of South FloridaFollow

Document Type

Conference Proceeding

Publication Date

2005

Digital Object Identifier (DOI)

https://doi.org/10.1115/IMECE2005-81532

Was this content written or created while at USF?

Yes

Citation / Publisher Attribution

Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition, Orlando, Florida, USA. November 5-11, 2005

Scholar Commons Citation

Waters, Patrick J. and Volinsky, Alex A., "Moisture Effects on Copper Thin Film Adhesion" (2005). Mechanical Engineering Faculty Publications. 278.
https://digitalcommons.usf.edu/egr_facpub/278