3C-SiC Films on Si for MEMS Applications: Mechanical Properties
Document Type
Article
Publication Date
2009
Digital Object Identifier (DOI)
https://doi.org/10.4028/www.scientific.net/MSF.615-617.633
Abstract
Single crystal 3C-SiC films were grown on (100) and (111) Si substrate orientations in order to study the resulting mechanical properties of this material. In addition, poly-crystalline 3C-SiC was also grown on (100)Si so that a comparison with monocrystaline 3C-SiC, also grown on (100)Si, could be made. The mechanical properties of single crystal and polycrystalline 3C-SiC films grown on Si substrates were measured by means of nanoindentation using a Berkovich diamond tip. These results indicate that polycrystalline SiC thin films are attractive for MEMS applications when compared with the single crystal 3C-SiC, which is promising since growing single crystal 3C-SiC films is more challenging. MEMS cantilevers and membranes fabricated from a 2 µm thick single crystal 3C-SiC grown on (100)Si under similar conditions resulted in a small degree of bow with only 9 µm of deflection for a cantilever of 700 µm length with an estimated tensile film stress of 300 MPa. Single crystal 3C-SiC films on (111)Si substrates have the highest elastic and plastic properties, although due to high residual stress they tend to crack and delaminate.
Was this content written or created while at USF?
Yes
Citation / Publisher Attribution
Materials Science Forum, v. 615-617, p. 633-636
Scholar Commons Citation
Locke, Christopher; Kravchenko, G.; Waters, P.; Reddy, J. D.; Du, K.; Volinsky, A. A.; Frewin, Christopher L.; and Saddow, Stephen E., "3C-SiC Films on Si for MEMS Applications: Mechanical Properties" (2009). Mechanical Engineering Faculty Publications. 273.
https://digitalcommons.usf.edu/egr_facpub/273
