Graduation Year
2021
Document Type
Thesis
Degree
M.S.M.S.E.
Degree Name
MS in Materials Science and Engineering (M.S.M.S.E)
Degree Granting Department
Engineering
Major Professor
Venkat Bhethanabotla, Ph.D.
Co-Major Professor
Conrad Lovell, Ph.D.
Committee Member
D. Yogi Goswami, Ph.D.
Keywords
Ceramic Resistors, Heat Pipes, Heat Sink, Isothermalization, Phase-Change Materials
Abstract
Advances in materials science and engineering in the field of thermal transport and dissipation enable the use of higher-performance electronic devices that are smaller and generate more heat. Phase change thermal transport systems such as heat pipes and vapor chambers enable passive dissipation from devices that generate excessive heat without the need for actively pumped cooling systems. Properly designed vapor chamber enabled systems easily exceed the thermal conductivity of manufactured diamond at a small fraction of the cost.[1][2][3] While heat pipe phase change systems are generally one-dimensional with a limited cross section, vapor chambers are generally two-dimensional with a small thickness.Research is needed in the optimization of layered vapor chambers and heat pipes while focusing on the orientations and sizes, fusing methods, heat sink materials and topographies, and the coatings and anodizations to maximize emissivity for an effective passive thermal management system. This research focused on one-square-inch-scale devices and tested optimized systems for maximum continuous and short-pulse power dissipations while limiting the system weight and size to maximize potential applications.
Scholar Commons Citation
Daniels, Derek Joseph, "Material and Topographically Optimized Thermal Dissipation for High-Performance Electronic Devices Utilizing Vapor Chambers" (2021). USF Tampa Graduate Theses and Dissertations.
https://digitalcommons.usf.edu/etd/9665
Included in
Chemical Engineering Commons, Materials Science and Engineering Commons, Other Education Commons