Evaluation of Reduced Graphene Oxide for Advanced Thermal Management in Microwave Electronics Packaging

Graduation Year

2024

Document Type

Thesis

Degree

M.S.E.E.

Degree Name

MS in Electrical Engineering (M.S.E.E.)

Degree Granting Department

Electrical Engineering

Major Professor

Jing Wang, Ph.D.

Committee Member

Stephen Saddow, Ph.D.

Committee Member

Arash Takshi, Ph.D.

Keywords

rGO Ground Plane, Graphene Film, RF Conductivity, rGO

Abstract

The continuous push towards making electronic devices smaller and denser, largely driven by the demand for higher power capabilities, has led to a critical need for innovative and comprehensive methods for managing the heat these devices generate. Traditional cooling solutions for electronics often rely on methods such as copper-based layers or channels to distribute and dispel heat. However, these conventional methods and materials are becoming increasingly insufficient, especially for Radio Frequency (RF) and millimeter-wave electronics. These components are becoming ever more compact while requiring more power, thus presenting unique challenges for thermal management in their packaging.

In this thesis we explore the potential of reduced graphene oxide (rGO) films as a highly effective material for thermal management within RF electronic packages. Its remarkable thermal conductivity, which far exceeds that of copper, alongside its compatibility with current manufacturing processes, positions rGO as an attractive solution for addressing the heat dissipation challenges posed by small, high-power electronic packages. Studies have shown that rGO films can significantly outperform copper in terms of thermal conductivity, offering a new avenue for more efficient heat management in electronics.

An innovative method to incorporate rGO films in RF packaging for improved heat management involves utilizing them as heat-spreading layers embedded in the multilayered architecture of RF/mm-wave electronic packages. By incorporating rGO films, heat generated by the surface electronics at hotspots can be dispersed more efficiently across the package, improving thermal performance by minimizing hotspots. However, integrating rGO in high-frequency electronics requires careful consideration due to its high electrical conductivity and the potential for affecting the transmission properties of RF circuits. While rGO's electrical properties offer the possibility of entirely replacing copper ground planes in certain applications, such a replacement necessitates additional design and manufacturing considerations to avoid negatively impacting the circuit's performance.

The exploration into using rGO films as ground planes in RF electronic packaging forms the core of this study. By reducing graphene oxide (GO) utilizing a novel two-step process, chemical followed by thermal, to produce rGO films and integrating these as ground planes in prototype packages, this work meticulously assesses their impact on RF performance through Transmission line measurements and ADS simulations, and thermal performance via IR imaging and Ansys ICEPAK simulations. This investigation seeks to fill a significant knowledge gap regarding the feasibility and potential limitations of rGO ground planes in RF electronics, providing a detailed assessment of their performance and opening new pathways for the development of more efficient thermal management solutions in electronic packaging.

In essence, this thesis explores the field of advanced materials science, aiming to utilize the exceptional thermal and electrical properties of rGO for thermal management in the increasingly complex and demanding RF electronics packages. By doing so, it not only addresses the immediate challenges faced by the industry but also paves the way for future innovations in electronic design and manufacturing, promising to significantly enhance device performance and reliability.

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