The present invention presents a novel application of a wavelet-based multiscale method in a nanomachining process chemical mechanical planarization (CMP) of wafer fabrication. The invention involves identification of delamination defects of low-k dielectric layers by analyzing the nonstationary acoustic emission (AE) signal collected during copper damascene (Cu-low k) CMP processes. An offline strategy and a moving window-based strategy for online implementation of the wavelet monitoring approach are developed.
Ganesan, Rajesh; Das, Tapas K.; Sikder, Arun K.; and Kumar, Ashok, "System and method for the identification of chemical mechanical planarization defects" (2008). USF Patents. 596.
University of South Florida