Document Type
Article
Publication Date
June 2025
Patent Number
12320028
Abstract
A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.
Application Number
18/145732
Recommended Citation
Takshi, Arash and Rosa-Ortiz, Sabrina Marie, "Electrochemical three-dimensional printing and soldering" (2025). USF Patents. 1509.
https://digitalcommons.usf.edu/usf_patents/1509
Assignees
UNIVERSITY OF SOUTH FLORIDA
Filing Date
12/22/2022
