Graduation Year

2025

Document Type

Dissertation

Degree

Ph.D.

Degree Name

Doctor of Philosophy (Ph.D.)

Degree Granting Department

Mechanical Engineering

Major Professor

Wenbin Mao, Ph.D.

Co-Major Professor

Ying Zhong, Ph.D.

Committee Member

Sarath Witanachchi, Ph.D.

Committee Member

Arash Takshi, Ph.D.

Committee Member

Jing Wang, Ph.D.

Committee Member

Sylvia Thomas, Ph.D.

Keywords

3D Architectures, Binder-free, Flexible Sensors, Greenhouses, Plasma, Ultrafast

Abstract

The field of printed electronics (PEs) is expanding rapidly, driven by increasing market demand. According to reports, the global market for PEs is expected to reach $23 billion by 2026, with a compound annual growth rate of 18.3% from 2023 to 2028. This growth necessitates the development of innovative printing technologies that can meet these demands efficiently, delivering high-quality, high-resolution PEs suitable for applications in health, environmental monitoring, sports, aerospace, and more.

Currently, PEs manufacturing relies on two main groups of printing technologies. Contact printing methods offer high-speed production but struggle with precision, while non-contact methods provide high resolution but suffer from slower printing speeds. A common challenge across these methods is the use of polymer binders, which require extended time and high temperatures for sintering. These binders can negatively impact the sensitivity and performance of the functional materials in PEs.

In this dissertation, I introduce a novel printing technology enabled by corona discharge (CD), known as corona discharge-enabled electrostatic printing (CEP). This non-contact technique allows for the manufacturing of PEs without the need for polymer binders. Additionally, I explore another capability of corona discharge: its effectiveness in disinfecting a wide range of surfaces. By leveraging the different conductivities of substrates in the CEP setup, I demonstrate a novel automated electrostatic patterning (AEP) process that creates predefined patterns for PEs. Through finite element analysis and photogrammetry testing, we uncover the material transfer mechanisms in the corona discharge-enabled electrostatic field and the AEP process.

Furthermore, this work showcases CEP-printed PEs used in applications such as strain sensing and greenhouse humidity regulation. Finally, we explore the rapid manufacturing of 3D architectures and investigate the underlying principles of their assembly process. This research not only highlights the potential of corona discharge in advancing PEs but also provides a foundation for future studies in both 2D and 3D electrostatic printing.

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