Experimental Testing of Micro-Scale Self Assembly Process Model
Digital Object Identifier (DOI)
Self assembly holds potential as a more efficient mass-production tool for integration of micro and nano-scaled devices, than traditional pick-and-place methods. While there has been significant innovation in self- assembly demonstrations, less progress has been made on models to predict the relationship between process rates and yields and key process parameters. This work is meant to gather experimental data on capillary self assembly process for micrometer scaled devices, using a controlled experimental assembly system. The purpose is to identify appropriate process variables that can be used to characterize self-assembly processes. Candidate process variables include kinetic energy, angle of impact, surface binding energy, shape and size of surfaces, and fraction area of assembly. Significant improvements to the previously reported self assembly test system are shown. While the experimental techniques continue to be refined, empirical relations are shown for various angles of impact, with fixed kinetic and binding energy values.
Was this content written or created while at USF?
Citation / Publisher Attribution
ASME 2011 International Mechanical Engineering Congress and Exposition, v. 11, p. 337-343, art. IMECE2011-65728
Scholar Commons Citation
Carballo, Jose M.; Hollis, Sean; and Crane, Nathan B., "Experimental Testing of Micro-Scale Self Assembly Process Model" (2011). Mechanical Engineering Faculty Publications. 40.