Title

Moisture Effects on Copper Thin Film Adhesion

Document Type

Conference Proceeding

Publication Date

2005

Digital Object Identifier (DOI)

https://doi.org/10.1115/IMECE2005-81532

Was this content written or created while at USF?

Yes

Citation / Publisher Attribution

Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition, Orlando, Florida, USA. November 5-11, 2005

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